Achieve system-level, scalable, and optimized 3D-IC EM simulation It is essential to come to terms with the reality that 3D-IC is one of the most difficult EM simulation problems to solve today. This ...

The Challenge of Electromagnetic Modeling and Simulation for Silicon Interposers in 2.5D/3D-IC Chip Designs Matt Commens is a senior manager for product management at Ansys. Tags: 3D-IC advanced ...

Shetha Nolke, principal product manager for Calibre 3DStress at Siemens EDA, told EDN that this tool performs three key tasks for chip-package stress analysis in 3D IC designs. First, stress ...

Now that chip designers have information at the dies and package levels, this information can be passed upstream to the board level or even to the large system level, like a jet engine design. Related ...

United Microelectronics (UMC) has certified Ansys' multiphysics solutions to simulate the foundry's latest 3D-IC WoW stacked technology, which will improve the power, efficiency, and performance ...

Fig 1. The system-in-package approach is part of the trend toward thinner and more integrated 3D IC packages for CPUs, GPUs, and FPGAs for use in camera modules and wireless products, where high ...

--Ansys has collaborated with TSMC and Microsoft to validate a joint solution for analyzing mechanical stresses in multi-die 3 D-IC systems manufactured with TSMC's 3 DFabric™ advanced packaging ...

Demands for lower-cost, higher-density, and smaller-footprint ICs aimed at portable electronics make 3D-packaging designers sweat. The push for 3D packaging of semiconductor ICs directly results ...

Recently, Faraday announced a 2.5D/3D-IC advanced package service to address exploding demand for multi-die designs that target products with better performance and lower power consumption.

Ansys achieved certification of its advanced semiconductor design solution for TSMC's high-speed CoWoS ® and InFO 2.5 D and 3 D advanced packaging technologies Ansys' comprehensive suite of power ...