While the iPhone 17 series is still three months away from launching, rumors about next year's iPhone 18 models continue to ...

Apple's rumored A20 chip could bring 2nm tech, new packaging design, and big gains in efficiency, performance, and battery ...

Apple’s iPhone 18 series is expected to feature the A20 chipset, which is expected to be built on TSMC’s second-generation ...

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging ...

Apple is planning to overhaul its chip design for the 2026 iPhones, marking the first time it uses advanced multi-chip packaging.

Apple analyst Jeff Pu claimed that the iPhone 18 Pro, iPhone 18 Pro Max and Apple’s first foldable phone will all be powered ...

Apple’s upcoming A20 chip is set to debut in the iPhone 18 Pro, iPhone 18 Pro Max, and the first folding iPhone in September ...

Sarcina Technology has announced advances in its photonic package design capabilities for Co-Packaged Optics (CPO).

InFo and WMCM refer to Integrated Fan-Out packaging and Water-Level Multi-Chip Module packaging. The difference between the two is that InFo enables integration of components within the packaging.

excels at integrating multiple chips within the same package (hence the "Multi-Chip Module" part). This method allows more complex systems, such as CPUs, GPUs, DRAM, and other custom accelerators ...

The A20 chip that will be used in the iPhone 18 could be packaged with a new tech that will give Apple more configuration options, while still being as small as possible. Apple's chips, produced ...

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...