Aluminum alloy vacuum chambers are critical components in semiconductor manufacturing, providing the controlled environment required for processes li ...

A research team led by Profs. Chen Deyong and Wang Junbo from the Aerospace Information Research Institute (AIR) of the ...

In particular, a new type of packaging defect phenomenon—die-pop—is observed. Vacuum reflow process has been able to reduce the solder void size to minimum value consistently but there is an ...

Semiconductor packaging underfill reduces the impact of the global thermal expansion mismatch between the substrate and silicon chip. Surfaces beneath flip chips, chip-scale packages, and ball grid ...

Dublin, June 17, 2025 (GLOBE NEWSWIRE) -- The "The Global Advanced Semiconductor Packaging Market 2025-2035" report has been added to ResearchAndMarkets.com's offering. The Global Advanced ...