Aluminum alloy vacuum chambers are critical components in semiconductor manufacturing, providing the controlled environment required for processes li ...

In particular, a new type of packaging defect phenomenon—die-pop—is observed. Vacuum reflow process has been able to reduce the solder void size to minimum value consistently but there is an ...

A research team led by Profs. Chen Deyong and Wang Junbo from the Aerospace Information Research Institute (AIR) of the ...

Semiconductor packaging underfill reduces the impact of the global thermal expansion mismatch between the substrate and silicon chip. Surfaces beneath flip chips, chip-scale packages, and ball grid ...

Arizona State University-affiliated research programs and laboratories will receive $1.2 billion in new funding for semiconductor packaging, winning two of four new national awards announced by ...