The ability to conduct system-level co-design of the chip and package makes it possible to optimize bump and ball placement, I/O placement and pin assignment to lower chip, package and PCB layer ...

Fig. 2: DSMBGA package. Source: Amkor. Fan-out WLP is another package option for SiPs. In one example of fan-out, a DRAM die is stacked on a logic chip. 2.5D/3D packages, meanwhile, are used in ...

Introducing SAMA7D65 Microprocessors Available in System-in-Package and System-on-Chip with Advanced Graphics and Connectivity Features Provided by GlobeNewswire Feb 26, 2025 1:00pm ...

Good things come in small packages and that's what I foresee in 2006. More precisely, chip designers next year will have a means to design their chips with an eye toward its packaging and the entire ...

By performing early chip, package and system thermal analysis, designers can systematically predict the power profile of the chip for various scenarios and its impact on power-thermal reliability.

To make a multicore SoC like STMicro’s work most effectively, it of course needs a PCB as well as the required components, preferably packaged into one solution much like Octavo’s OSD32MP1 SiP ...

IBM Power7 chip IBM. The processor is a big step for IBM, integrating eight processing cores--four times the number of cores in the prior-generation Power6--in one chip package, with each core ...

Many design teams are taking a harder look at the system-in-package alternative to conventional system-on-chip design. The advantages of combining multiple dice in one package have been ...

--Mercury Systems, Inc., a leader in trusted, secure mission-critical technologies for aerospace and defense, announced it received a $3.9 million multi-phase contract award from a leading defense ...