A new way to make ultra-thin diamond wafers using sticky tape could help produce diamond-based electronics, which might one day be a useful alternative to silicon-based designs. Diamond has ...

Scientists in China have discovered a better way to build small, high-performance electronic parts using ultra-thin materials ...

University Wafer's GaAs substrates are integral to the rapidly growing field of RF and microwave electronics, crucial for telecommunications, radar, and satellite communication technologies.

RRP Electronics, a leading OSAT (Outsourced Semiconductor Assembly and Test) player in India, plans to buy a silicon wafer line, along with process and technology know-how transfer from PTW ...