Amid US-China trade tensions and the potential for new US semiconductor tariffs under President Donald Trump, Taiwan's IC packaging and testing industry is showing strong first-quarter 2025 results.

Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor ...

The Siemens technologies certified in this reference flow include Innovator3D™ IC, Calibre® nmDRC and nmLVS, Xpedition™ Package Designer, Calibre® 3DThermal, HyperLynx™ SI/PI, and Calibre® 3DStack.

Advanced packaging is inevitable. Large systems companies and processing vendors already are working with various types of highly engineered packaging. The rest of the semiconductor industry will ...

Intel Foundry Direct Connect 2025 took place this week in San Jose, California, and the company reported progress on its ...

Advanced packaging is inevitable. Large systems companies and processing vendors already are working with various types of highly engineered packaging. The rest of the semiconductor industry will ...

While a cleanroom overhaul is inherently expensive and disruptive, these costs may be minimal compared to the potential of quantum technology. A quantum chip from Google was recently able to complete ...

About 10% to 20% will be spent for specialty technologies and about 10% to 20% will be spent for advanced packaging ... provider of the global logic IC industry for years to come, while delivering ...

Growth drivers include demand for sustainable packaging, clean-label products, and plant-based diets. Challenges like high production costs and raw material availability exist. Key players include ...