One key element of the IC package is the substrate, which is essentially a miniature circuit board with copper traces that bonds to the input/output (I/O), ...

Keeping IC Packages Cool. Engineers are finding ways to effectively thermally dissipate heat from complex modules. June 7th, 2022 - By: Laura Peters and Karen Heyman. Placing multiple chips into a ...

In an era where artificial intelligence, autonomous vehicles, and high-performance computing push the boundaries of ...

Image Credit: Stas Knop/Shutterstock.com. A Brief Introduction to Semiconductor/IC Packaging. IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or ...

Researchers at the Jülich Research Center and the Leibniz Institute for Innovative Microelectronics (IHP) have developed a ...

Phison Electronics Corp. (TPEX: 8299), a global leader in NAND flash controller integrated circuits and storage solutions, today entered into the high ...

First is the NeoGene Liquid Cooler which will be used for packaged IC heat dissipation at 1 U configuration. The second is the Direct-to-Silicon Cooling Package Module, which can be adopted by IC ...

IR’s new IRS2505L power factor correction boost IC comes in a 5-pin SOT23 package for switch mode power supply, LED drivers, and fluorescent and HID electronic ballast applications.

Power Integrations added a wide-creepage package option to its InnoSwitch3-AQ flyback switcher IC for automotive applications: A wide drain-to-source-pin creepage distance of 5.1 mm eliminates the ...