News
AMD plans to make Malaysia its strategic hub for advanced semiconductor packaging and design, with operations focused in ...
2d
Free Malaysia Today on MSNAMD eyes Malaysia as hub for advanced chip packaging, designFounded in 1968, AMD designs and manufactures CPUs, GPUs and other graphic solutions for customers like Microsoft, Sony (for ...
At the heart of the move is Tesla’s push to secure the supply chain for its EVs. The ongoing US-China trade tensions, ...
A former employee surnamed Kim at the Chinese division of South Korean chipmaker SK Hynix has been indicted on charges of ...
Intel asserts it is the industry leader in packaging technologies for semiconductors, which today have expanded capabilities ...
Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor ...
Intel's new roadmap; EU chip plan needs work; RISC-V boost; UK IC workforce study; materials and wafer shipments; on-chip PDN ...
11h
Tom's Hardware on MSNFormer SK hynix employee transferred advanced chip packaging technologies to HuaweiA former SK Hynix employee has been charged with stealing wafer bonding and image sensor technologies to secure a job at ...
2d
Malay Mail on MSNAnwar: AMD to make Malaysia global hub for advanced chip design and packagingMalaysia is rapidly emerging as a preferred destination for high-value investments, with Prime Minister Datuk Seri Anwar ...
Advanced semiconductor packaging market is segmented by type. This includes: Fan-Out Wafer-Level Packaging (FOWLP), Fan-In Wafer-Level Packaging (FIWLP), Flip Chip (FC), 2.5D/3D), by application -- ...
Innovations in semiconductor technology—such as advancements in AI high-performance computing (HPC), Angstrom-scale silicon ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results