AMD plans to make Malaysia its strategic hub for advanced semiconductor packaging and design, with operations focused in ...

Founded in 1968, AMD designs and manufactures CPUs, GPUs and other graphic solutions for customers like Microsoft, Sony (for ...

Before applying for incentives to build a chip fabrication unit under ISM, Vembu had also announced Zoho's plans to set up a ...

Intel asserts it is the industry leader in packaging technologies for semiconductors, which today have expanded capabilities ...

Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor ...

NVIDIA's new B300 AI chip production has reportedly been pulled forward to May: will use TSMC 5nm process (N4P) and CoWoS-L ...

Global gold prices have surged to an all-time high of US$3,500 per ounce, putting significant cost pressure on the semiconductor packaging industry. The gold bumping process—essential for display ...

Intel's new roadmap; EU chip plan needs work; RISC-V boost; UK IC workforce study; materials and wafer shipments; on-chip PDN ...

A former SK Hynix employee has been charged with stealing wafer bonding and image sensor technologies to secure a job at ...

Malaysia is rapidly emerging as a preferred destination for high-value investments, with Prime Minister Datuk Seri Anwar ...

Advanced semiconductor packaging market is segmented by type. This includes: Fan-Out Wafer-Level Packaging (FOWLP), Fan-In Wafer-Level Packaging (FIWLP), Flip Chip (FC), 2.5D/3D), by application -- ...

Innovations in semiconductor technology—such as advancements in AI high-performance computing (HPC), Angstrom-scale silicon ...