The new packages will be shown for the first time publicly at the upcoming PCIM exhibition on CGD’s booth # 7 643, Nürnberg Messe, Nuremberg, Germany, 11-13th June 2024. About Cambridge GaN Devices ...

First is the NeoGene Liquid Cooler which will be used for packaged IC heat dissipation at 1 U configuration. The second is the Direct-to-Silicon Cooling Package Module, which can be adopted by IC ...

Phison Electronics Corp. (TPEX: 8299), a global leader in NAND flash controller integrated circuits and storage solutions, today entered into the high ...

Employing package design as part of system innovation requires the STMicroelectronics Back-End Manufacturing Technology R&D organization to embrace the key driving forces of product development. In ...

In heterogeneous 3D IC architectures, the interaction between the chips and packages can compromise device functionality if not properly validated. Research has shown these thermo-mechanical stress ...