Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the ...

LOS ANGELES -- Aug., 2005 -- At SIGGRAPH 2005 (Booth 1854, Hall J), Falanx Microsystems, Inc., a rapidly emerging force in the mobile graphics/video IP core market, today introduced the first in its ...

This series explores challenges and solutions to the pace of integration and increased performance needed for tomorrow’s embedded applications, and how system-in-package fits ...

A system in package (SiP) that integrates high-side and low-side MOSFETs and their driver IC has been developed for voltage regulators. Compared with the conventional discrete package, the SiP offers ...

This paper presents a system-in-package (SiP) with Cu-plate bonding for voltage regulators. The SiP reduces the power loss by 23% and the thermal resistance by 44% compared to those of a SiP with wire ...

As digital transformation accelerates across financial services, for many banks, the foundation of innovation increasingly rests on a critical component: its core banking system. No longer just a ...