Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the ...

The SiP's small form factor, 17x17mm in size and 1.4mm high, integrates Samsung's S3C2410 ARM-based application processor, 256Mb of NAND flash memory and 256Mb of SDRAM memory. The S3C2410 is the ...

Ideally, the SiP specialists will be involved in the design from the early stages. Even when the design is just a block-level sketch on a napkin, it’s not too early to begin discussing how the IP ...

The SAMA7D65 SoC and SIP compete against other Cortex-A7 microprocessors, such as STMicroelectronics’ STM32MP13 family with a 1 GHz single-core Arm Cortex-A7 core and several Allwinner chips, for ...

Learn more about the motivations behind Cadence’s new Arm-based system chiplet in the latest installment of The Briefing.

To drive the technologies and products of the future, creative companies rely on end-to-end solutions across chips, IPs, packages, PCBs, and systems to meet strict design requirements and deliver ...

Octavo Systems has launched two system in package devices using a multicore embedded AI processor from STMicroelectronics. The Octavo OSD32MP2 family consists of two System-in-Package (SiP) modules: ...

Unlock the power of SIP in modern VoIP systems. Discover its seamless connectivity, enhanced collaboration, and cost efficiency benefits at TechRound.

Transphorm SuperGaN SiP from Weltrend is a cost-effective solution proven to support 65 W & 100 W power adapters, offering economies of scale.