In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire sweep has become the main factor affecting the reliability of the product.

He investigates novel techniques for integrated circuits counterfeit detection/prevention, system and chip level reverse engineering, anti-reverse engineering, invasive and semi-invasive physical ...

You may have heard the phrase “flip-chip” before: it’s a broad term referring to several integrated circuit packaging methods, the common thread being that the semiconductor die i… ...

TSMC may be exploring foundries for Chip-on-Wafer-on-Substrate (CoWoS) technology. This advanced packaging technology, developed by TSMC 3DFabric, is crucial for major tech companies seeking to boost ...

He investigates novel techniques for integrated circuits counterfeit detection/prevention, system and chip level reverse engineering, anti-reverse engineering, invasive and semi-invasive physical ...

FREUDENSTADT, Germany, May 28, 2024 (GLOBE NEWSWIRE) -- Today, SCHMID Group N.V. (Nasdaq: SHMD) announces taking next step towards advanced packaging for integrated circuits with glass cores.

The present disclosure is related to integrated circuit packaging, and more specifically to methods and apparatus for integrally molding a die and one or more bezel structures, ...

A photonic integrated circuit is an integrated circuit with optical functions. Optical signals travel at the speed of light, which is faster than electronic ... Because the dies are stacked in a ...