Hardware-Software Co-Optimization for End-to-End Communication in Multi-Chip-Modules” was published by researchers at Georgia ...

The iPhone 18 could get a performance gain from memory, with Apple rumored to be using a new faster memory option in the 2026 ...

Apple in October 2024 overhauled its 14-inch and 16-inch MacBook Pro models, adding M4, M4 Pro, and M4 Max chips, Thunderbolt ...

Today's high-end processors, especially those powering data centers and AI workloads, already rely on multi-chiplet designs to meet soaring demands for performance and memory bandwidth. TSMC's ...

The QRNG module will be available commercially for potential customers through the CPPICS spin-off start-up "LightOnChip".

Cerence AI, in collaboration with MediaTek and NVIDIA, has unveiled an advanced multi-modal language model designed for ...

ASE's powerSiP technology redesigns power delivery with a vertically integrated, multi-stage VRM that reduces power losses ...

Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel ...