The LPDDR6 standard for mobile memory is officially here, thanks to the JEDEC. The global standards body says LPDDR6 memory ...

CrOCl's layered structure remains stable at high temperatures, making it ideal for next-gen CMOS and spintronic devices with ...

China remains at a disadvantage in high-bandwidth memory (HBM) and other advanced chip technologies, with sanctions on ...

Professor Prem Kumar and a multi-institution research team built a first-of-its-kind silicon chip combining a photonic ...

A few years ago, physicists were surprised to learn that stacking and subtly twisting two atomically thin layers of an ...

Synchron, a top Neuralink competitor, rarely lets journalists visit its New York headquarters. What I saw there reveals the ...

SK hynix's DRAM memory chip roadmap for the next 30 years includes 4F2VG (vertical gate) tech, 3D DRAM, and more innovation coming in the future.

Saimemory will focus on developing stacked, energy-efficient DRAM memory chips for AI applications.

A schematic representation of in-memory computing using electrochemical memory devices (ECRAMs) arranged in a cross-point array structure, mimicking the way synapses in the brain process information.

A new technical paper titled “Design of Energy-Efficient Cross-coupled Differential Photonic-SRAM (pSRAM) Bitcell for High-Speed On-Chip Photonic Memory and Compute Systems” was published by ...

In contrast, antiferromagnets have a different structure — their atomic spins alternate in an up-down pattern, canceling each other out and resulting in no overall magnetization. This makes them ...

The US government has imposed fresh export controls on the sale of high tech memory chips used in artificial intelligence (AI) applications to China. The rules apply to US-made high bandwidth ...