Innovations in semiconductor technology—such as advancements in AI high-performance computing (HPC), Angstrom-scale silicon ...

As demand grows for more powerful and efficient microelectronics systems, industry is turning to 3D integration—stacking ...

The chip saves space, cuts energy loss, removes the need for heat sinks, supports modern devices, reduces parts, and helps ...

Apple is reportedly advancing work on its first smart glasses, designed to rival Meta’s Ray-Ban Meta AI eyewear, with a focus ...

Intel has been showing off its direct cooling experiments, with waterblocks fitted directly to its Intel Core Ultra and Xeon ...

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next ...

The devices offer high reliability, better cooling, and longer life for tough uses like EVs, solar, data centers, and more ...

The chip powering the glasses is reportedly based on the System in Package (SiP) used in the Apple Watch, chosen for its compact design and superior energy efficiency compared to chips found in ...

The company plans expansion in the US, with two advanced packaging facilities to be constructed near its Arizona chip fabs.

Fuses integrate power switches, digital controllers, current sensing, and all of the other smarts for hot swapping in a ...

Nordic’s position in the semiconductor supply chain is weak. Foundries might prioritize larger players such as automobile companies, which use similar manufacturing technologies as Nordic. Nordic has ...