Xiaomi’s XRING O2 chip will debut in a vehicle, not a phone—signaling a bold move toward unified device architecture.

The best foldable of 2024 has returned in better shape and form. Read our HONOR Magic V5 review to find out if it's the best ...

With chiplets gaining traction, chip designers face a critical question: When should you step away from a monolithic ASIC? The answer, according to IC-Link by imec, is ...

System-level test (SLT) has evolved into a necessary test insertion for high-performance processors and chiplets.

Off-the-board technology has proceeded in three waves, and the third wave is still unfolding. Based on the author’s experience working with startups, the third wave may coincide with the end of copper ...

International Business Machines on Tuesday announced a new line of data center chips and servers that it says will be more power-efficient than rivals and will simplify the process of rolling out ...

The main reasons integrated circuit packages changed were the need for more connections, smaller sizes for mobile devices, and better cost and performance. As chips got more complex, the integrated ...

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new packaging ...

Emulate, Inc., the world leader in Organ-on-a-Chip technology, today announced the commercial launch of the AVA™ Emulation System, a self-contained instrument that cultures, incubates, and ...

Chip Scale Packages (CSPs) have the advantage of smaller size and low package profile, lesser weight, relatively easier assembly process, lower overall manufacturing costs and improved electrical ...

Nexperia has introduced a new range of high signal integrity, bidirectional electrostatic discharge (ESD) protection diodes housed in advanced flip-chip land-grid-array (FC-LGA) packaging. This ...