A Design-for-test (DfT) technique is proposed in this paper for a test method, by which detecting open defects occurring interconnects between 3D stacked SRAM IC and a printed circuit board and among ...

In wireless communication and high-speed interconnect systems, passive circuits between integrated circuits (ICs) are often consolidated within a single package module. Glass interposers have gained ...

In this video, we review the Cube 16x20, highlighting its features and functionality. We cover the design specifications, materials used, and performance in various settings. Stay tuned for an in ...