Czech-based electron microscope manufacturer TESCAN is undergoing a strategic shift, expanding into advanced semiconductor ...

The core problem inherent in routing 448G channels in PCBs is in the via transitions used in BGA escape routing, as well as ...

The EDA trio—Cadence, Siemens EDA, and Synopsys—was prominent at the Intel Foundry Direct Connect 2025 while lining up ...

Rohm has developed new 4-in-1 and 6-in-1 SiC muolded modules in the HSDIP20 package optimised for PFC and LLC converters in ...

The range of topics to be covered at ECTC 2025 encompasses heterogeneous integration, photonics, components, materials, assembly, reliability, modeling, interconnect design and technology, ...

Also announce tool certification for TSMC N3C process and initial collaboration on TSMC’s newest A14 technology ...

Dublin, April 23, 2025 (GLOBE NEWSWIRE) -- The "China's IC Design Industry in 2025: Market Trends and Production Analysis" report has been added to ResearchAndMarkets.com's offering. The ...

Do you know that feeling when you find a package so appealing that you just have to pick it up? That is the power of creative packaging design. Do you know that feeling when you find a package so ...

When it comes to products and packaging, each design decision has the power to include or exclude possible customers. For nearly 60 million adults living with arthritis and many more with chronic pain ...

The chipset will now use a new BGA888 package, which measures 24mm x 25mm—smaller than the 28mm x 23.5mm package used in Intel’s current 800 series chipsets. This smaller size for the BGA888 ...

Recyclable packaging is becoming more common, and now ProAmpac has shared its attainment of new U.S. patents for its ProActive Sustainability line of recyclable and recycle-ready packaging. The ...

Abstract: A novel antenna-in-package (AiP) of a two-dimensional (2-D) array is proposed for Sub-THz applications at the 250-310GHz band. The 2-D array is decomposed into several one-dimensional (1-D) ...