Challenges with SiC technology, starting from the difficult and lengthy SiC substrate growth all the way to the complex ...

The EasyPACK CoolGaN module integrates 650 V CoolGaN power semiconductors with low parasitic inductances, achieved through ...

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Abstract: Wire bonding as a metallic interconnection is widely used to transmit high-speed signals and supply power within the integrated circuit (IC) packages. However, bonding wires also effectively ...

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More specifically, ECD is used to deposit metals in the key interconnect structures within an IC package, such as bumps, copper pillars, redistribution layers (RDLs) and through-silicon vias (TSVs).