Intel's new roadmap; EU chip plan needs work; RISC-V boost; UK IC workforce study; materials and wafer shipments; on-chip PDN ...

Hardware-Software Co-Optimization for End-to-End Communication in Multi-Chip-Modules” was published by researchers at Georgia ...

But, even as we face these challenges, many companies continue to innovate in ways that surprise and delight us. It’s time to ...

The iPhone 18 could get a performance gain from memory, with Apple rumored to be using a new faster memory option in the 2026 ...

Today's high-end processors, especially those powering data centers and AI workloads, already rely on multi-chiplet designs to meet soaring demands for performance and memory bandwidth. TSMC's ...

Cerence AI, in collaboration with MediaTek and NVIDIA, has unveiled an advanced multi-modal language model designed for ... On Thursday, the company introduced the MCPF1412 power module, offering ...

TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120×150 mm substrates with integrated power management for future AI and HPC processors.

AAEON’s COM-MTHC6 COM Express Type 6 module is powered by the Intel Meteor Lake H processor series with a choice between the Core Ultra 9 185H, Core Ultra 7 155H, or Core Ultra 5 125H CPUs. The module ...

Through ablation experiments, the contribution of each module to the overall performance (regarding accuracy and robustness) of RH-AVSWM has been assessed. Given that RH-AVSWM achieves comparable or ...

Nvidia predicts $5.5 billion in H20 export-related costs to China and other nations H20 chips were already meant to be optimized for the Chinese market Company shares are down, market cap stays ...

The teaser images also show a similar design to the Z10, with a circular camera module on the back, a punched-out display on the front and slim bezels. If the rumours prove to be true, the Vivo T4 ...