Shorter development times and and cost-effective miniaturization make for an unbeatable combination. Those just happen to be the attributes of the quickly rising system-in-a-package (SiP) technology.

The impatient and hungry mobile electronics market is fueling the need for system packaging technologies as an interim solution before the inevitable transition to system-on-chip methodologies. While ...

Silicon Burrito May 13, 2002, 12:00am EDT Jun 06, 2013, 12:58pm EDT. Share. Save. ... The industry has dubbed it the "SiP"--the "System in Package." Not a very inspired name, perhaps, ...

Handheld device manufacturers can now integrate MEMS with electronic components and passives into one compact package, shortening development cycles and cutting fabrication time and cost by using ...

NEC and NEC Electronics America unveiled a system-in-package (SiP) technology that's capable of stacking logic and gigabit-class memory in one package to enable high-speed, high-definition image ...

SiP technology has been evolving through utilization of various package technology building blocks to serve the market needs with respect to miniaturization, higher integration, and smaller form ...

To that end, Maggy, a Belgium-based startup specializing in Bluetooth-enabled, rechargeable, social-distancing devices, has chosen a Silicon Labs Bluetooth system-in-package (SiP) module to enable ...

DUBLIN, March 26, 2021 /PRNewswire/ -- The "Semiconductor (Silicon) Intellectual Property (SIP) - Global Market Trajectory & Analytics" report has been added to ResearchAndMarkets.com's offering ...