Introducing SAMA7D65 Microprocessors Available in System-in-Package and System-on-Chip with Advanced Graphics and Connectivity Features Provided by GlobeNewswire Feb 26, 2025 1:00pm ...

Advancements in semiconductor fabrication technologies and chip packaging processes have been central to the explosive growth of these electronic devices. However, in today's age of artificial ...

Professor Prem Kumar and a multi-institution research team built a first-of-its-kind silicon chip combining a photonic ...

While chiplets have been around for decades, today they are the hottest trend in chip making powering millions of devices from PCs, to servers, phones and wearables.

ATA650x CAN FD System Basis Chips (SBCs) with a fully integrated high-speed CAN FD transceiver and a 5V Low-Drop Voltage Regulator (LDO) available in compact 8-, 10- and 14-pin space-saving packages.

The LD966L is green-mode PWMIC built-in with brown-in/out functions of a QFN8X8 package. It minimises the component count and circuit space and reduces overall material cost for the power applications ...

$52.7 billion for chip manufacturing and research. The package will invest $39 billion over five years to expand domestic semiconductor manufacturing.

Microchip Technology (Nasdaq: MCHP) today announces its portfolio of SAMA7D65 MPUs based on the Arm ® Cortex ®-A7 core running up to 1 GHz and offered in a System-in-Package (SiP) with a 2 Gb DDR3L ...

WASHINGTON — Congress has passed a bill that will invest more than $200 billion over the next five years to help the U.S. regain a leading position in semiconductor chip manufacturing.