News

Xiaomi’s XRING O2 chip will debut in a vehicle, not a phone—signaling a bold move toward unified device architecture.
The best foldable of 2024 has returned in better shape and form. Read our HONOR Magic V5 review to find out if it's the best ...
An interdisciplinary academic team has successfully integrated quantum light sources and control electronics onto a single silicon chip. In a significant advancement for quantum technology, ...
A new internal beta of One UI 8 has confirmed the chip that will appear in Samsung’s triple-screen foldable. “SM8750” appears ...
System-on-Chip (SoC) design integrates processors, memory, and a variety of IPs in a single design. Due to the FPGA capabilities and high time-to-market pressures, complex SoC designs are increasingly ...
Ferguson: This is a big part of what’s driving consolidation within the EDA industry. You see Siemens and Mentor and Altair ...
With chiplets gaining traction, chip designers face a critical question: When should you step away from a monolithic ASIC? The answer, according to IC-Link by imec, is ...
Employing more stress testing at the wafer level improves quality while reducing burn-in time and cost. So why isn’t it ...