Xiaomi’s XRING O2 chip will debut in a vehicle, not a phone—signaling a bold move toward unified device architecture.

The best foldable of 2024 has returned in better shape and form. Read our HONOR Magic V5 review to find out if it's the best ...

Ferguson: This is a big part of what’s driving consolidation within the EDA industry. You see Siemens and Mentor and Altair ...

With chiplets gaining traction, chip designers face a critical question: When should you step away from a monolithic ASIC? The answer, according to IC-Link by imec, is ...

Employing more stress testing at the wafer level improves quality while reducing burn-in time and cost. So why isn’t it ...

System-level test (SLT) has evolved into a necessary test insertion for high-performance processors and chiplets.

Off-the-board technology has proceeded in three waves, and the third wave is still unfolding. Based on the author’s experience working with startups, the third wave may coincide with the end of copper ...

International Business Machines on Tuesday announced a new line of data center chips and servers that it says will be more power-efficient than rivals and will simplify the process of rolling out ...

Based on a system-level design methodology and a modified power delivery network model, optimization and benchmarking are performed for a processor implemented with the power-gating technique under ...

In this paper, a novel wire bonding and BGA interconnect structure is applied to a highly integrated MMIC. The package is connected to the substrate through the BGA interconnection. A tapered line is ...

The main reasons integrated circuit packages changed were the need for more connections, smaller sizes for mobile devices, and better cost and performance. As chips got more complex, the integrated ...